Molex, the world's leading manufacturer of electronic solutions, recently announced the stAK50h unsealed connection system, which is designed to provide both signal and Ethernet connectivity in automotive body electronics, safety and driver assistance, comfort and infotainment equipment and modules.
Scott Marceau, global product manager at Molex, said: "The capabilities of today's cars continue to increase and the demand for connectivity is increasing, adding to the complexity of automotive electronics. The new hybrid stAK50h connector system eliminates the need for manufacturers. Two separate connection systems for signal and Ethernet are available to optimize space and design flexibility."
The USCAR-2 compliant stAK50h connection system reduces verification time for first-class automakers who make design changes and release new models. This stackable joint design eliminates the need for costly custom tooling, engineering, and verification times typically required for multiple in-vehicle equipment and module configurations.
This unit-to-multiple stAK50h connector system incorporates through-hole unsealed connectors and hybrid connectors to meet industry-standard footprint requirements for 0.50 mm, 1.20 mm, and 2.80 mm terminals that are widely used in automotive applications. The hybrid system provides 12 to 56 circuit sockets for a wide range of applications from low current signals (5.0 amps) to high power applications (30.0 amps).
In the design of the car, if the terminal design and the connector interface inside the vehicle are too complicated, it is easy to cause pairing errors and connection failures. The stAK50h unsealed connection system's connectors and sockets are matched in color for quick identification and easy assembly. The Connector Positioning Kit (CPA) latching feature prevents the stAK50h connection system from unintentionally disengaging.
Marceau added: "Our automotive customers have benefited from the high-performance stAK50h connector system, which speeds assembly and reduces time-to-market.
As an authorized distributor of Molex, Heilind can provide relevant services and support for the market. In addition, Heilind also supplies products from many of the world's top manufacturers, covering 25 different component categories, and pays attention to all market segments and all customers. Constantly seeking a wide range of product offerings to cover all markets.
The market is constantly demanding improved performance, reduced design size and reduced cost, which exposes electronic products to more harsh conditions and reliability issues. However, reliability is a key factor in the success of a product. Today's thermal design is inextricably linked to mechanical and electrical design, which places demands on integration technologies such as thermal simulation to achieve a total solution. With more than 20 years of experience in thermal simulation, Molex integrates a wide range of engineering and advanced software to deliver innovative and highly reliable designs to major OEMs worldwide.
The global competition in the electronics industry is intensifying, and new products are being released quickly, which has created a requirement to shorten the design development cycle. In addition, any product is produced under strict specifications and a limited budget. Because thermal simulation can be applied early in the design phase, presenting temperature and airflow in a unique way can help engineers make better decisions and design more efficient cooling systems. This also avoids costly failures and redesigns at a later stage. Thermal simulation allows engineers to experiment with simulations in a virtual environment, minimizing the number of product prototypes and ultimately getting the right solution. In short, you can speed up the design process, increase security, and reduce costs.
Molex has a highly experienced thermal modeling team that simplifies the modeling process with minimal time to resolution and highest accuracy. Molex's engineering team uses state-of-the-art simulation technology that integrates mechanical computing aids and electronic design automation to predict airflow, temperature and heat transfer, providing the right combination of design variables to meet customer goals. Molex's technical experience combined with advanced software/technology enables Molex to offer low-cost alternatives after considering conditions, behaviors and requirements for different environmental conditions. Molex uses advanced platforms and technologies for prototype testing; therefore, customers can be confident that they can get quality data.
Molex leads the design and manufacture of terminals and has successfully designed and supplied a variety of terminal connection systems for many major OEMs for more than 30 years. Molex's core competency lies in its ability to provide a complete range of connectivity system solutions for complex, customized products that are tested to perform well throughout the life of the product.
Molex's designers first analyzed electrical and mechanical designs, then conducted analytical modeling, numerical simulation, and tolerance analysis to test the terminals far beyond the requirements of the required specifications. This extreme conditional test allows Molex to exceed customer expectations and deliver a future-proof design. Molex tests the terminals for the entire life cycle of the product, which improves product life and reliability.
Molex's decades of design experience and extensive software/technologies have helped Molex to make a wide range of innovations in design, from the smallest pitch terminals to the operational limits. To the greatest extent, Molex leverages its extensive technical experience and expertise to integrate a wide range of technologies. In this way, Molex has become a trusted brand in the industry around the world.
Molex's terminal systems are found everywhere in the vehicle and can be located under the hood or throughout the body of a commercial vehicle or car. Because Molex provides a dedicated project team for vehicle systems such as body electronics, powertrain, safety and infotainment systems, customers can be confident that partnering with Molex means bringing real expertise to the team. With professional knowledge. Collaborate with Molex to bring your customers' designs to life.
Advances in wireless technology have opened up new opportunities for soft electronics. Near Field Communication (NFC) enables two-way short-range wireless communication, and is an emerging technology whose market positioning is the architecture that forms a flexible printed sensor system. Printed NFC sensor devices, such as wearable temperature monitors or tamper-detection devices, do not require a power supply, plug or wired connection on the board. The integrated chip that jumps online is close to the NFC-enabled reader. It will only start when it is a cellular device. The production of NFC sensor systems requires NFC functional components and sensor functional components. Now, through the use of printed silver soft manufacturing and assembly processes, the efficiency of the production of these two main functional components can be improved.
Recent advances in silver ink and printing technology have enabled the routing of conductive antenna coils required for each NFC tag mosaic layer or device onto highly durable, highly flexible polymer substrates. Conductive inks on polyester can significantly reduce the cost of the substrate compared to equivalent copper circuits. Sensors can be formed on or attached to the same substrate, and this process supports the addition of microcontroller (MCU) units and other electronic components for a fully integrated solution. From cargo and logistics to patient monitoring in pharmaceutical and medical facilities, NPC printed sensor systems are now shifting to many industries that require single use.
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