K4B2G0846C-HCH9 SAMSUNG FBGA-78 DDR

SAMSUNG
  • K4B2G0846C-HCH9

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  • Part Number
  • K4B2G0846C-HCH9
  • Product Categories
  • Memory
  • Package
  • FBGA-78
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The K4B2G0846C-HCH9 from SAMSUNG manufacturer is a Memory with DRAM Chip DDR3 SDRAM 2G-Bit 256Mx8 1.5V. More details for K4B2G0846C-HCH9 can be seen below.

Details

The K4B2G0846C-HCH9 is a dynamic random-access memory (DRAM) module that offers high-performance data storage and retrieval capabilities. Known for its reliability and efficiency, this memory component is designed to meet the demanding requirements of various data-intensive applications.

Feature

High-Speed Data Transfer: The K4B2G0846C-HCH9 is equipped with high-speed data transfer capabilities, enabling rapid and efficient data processing. This feature is particularly beneficial for applications that demand quick access to large data sets, ensuring smooth and uninterrupted data handling for tasks that require high-speed data transfer.

Large Memory Capacity: With a substantial memory capacity, this module allows for the storage of significant amounts of data. This feature is especially useful for applications that involve extensive data storage and management, ensuring seamless processing and storage of large data sets with efficiency and reliability.

Low Power Consumption: The module is designed to optimize power consumption, promoting energy efficiency and reduced power usage. This feature is particularly useful for applications that prioritize power conservation, allowing for extended battery life and efficient power management in electronic devices.

Compatibility and Integration: It is engineered for compatibility and seamless integration with various electronic systems and components, ensuring smooth operation and data processing across different platforms. This feature enhances the versatility and adaptability of the module in various electronic designs and systems, contributing to overall performance and functionality.

Robust Design: The K4B2G0846C-HCH9 is built with a robust design that ensures durability and reliability. This feature makes it suitable for applications that require long-term data storage and consistent data handling, providing reliable and stable data management capabilities.


Application

Data Centers and Servers: The module is extensively used in data centers and servers to support efficient data processing and storage. Its high-speed data transfer and large memory capacity contribute to enhanced performance and functionality, ensuring smooth data handling and reliable storage management in data-intensive environments.

Networking Equipment: It finds application in networking equipment such as routers, switches, and communication servers, facilitating efficient data transmission and processing. Its compatibility and low power consumption make it well-suited for optimizing the performance and energy efficiency of networking devices, ensuring reliable data management and transmission.

Consumer Electronics: The module is integrated into various consumer electronic devices, including gaming consoles, digital cameras, and multimedia players, supporting efficient data storage and processing. Its durability and compatibility enable the enhancement of consumer electronics' functionality and performance, ensuring reliable data storage and smooth operation.

Automotive Electronics: It is employed in automotive electronics, including in-vehicle infotainment systems and navigation units, to support reliable data storage and handling. Its durability and high-speed data transfer capabilities contribute to the efficient performance and data management of automotive electronics, ensuring seamless operation and reliable data processing.

Industrial Applications: The module is utilized in industrial applications, including industrial automation and control systems, supporting efficient data handling and processing in demanding industrial environments. Its robust design and high-speed data transfer capabilities make it suitable for optimizing the performance and reliability of industrial control systems, ensuring stable data management and consistent operation.


Categories
DDR
Manufacturer
Samsung Semiconductor
Veswin Part Number
V1518-K4B2G0846C-HCH9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Condition
New & Original - Factory Package
Stock Status
In-Stock Inventory
Minimum order
1
Estimated Delivery Time
On May 02 - May 07 (Choose Expedited Shipping)
EDA / CAD Models
K4B2G0846C-HCH9 by SnapEDA
Storage Condition
Dry storage cabinet & Humidity protection package
supply_voltage
1.5V
product_type
DDR3 SDRAM
product_name
K4B2G0846C-HCH9
package_case
FBGA
organization
256M x 8
operating_temperature
0°C to 95°C
memory_size
2Gb
manufacturer
Samsung
access_time
9ns

SAMSUNG Inventory

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SAMSUNG Original Stock

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  • Q: K4B2G0846C-HCH9 Warranty?
  • A: We Provide 90 days warranty for our product.
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  • A: Yes, Our product technical engineer will help you with the K4B2G0846C-HCH9 pinout information, application notes, replacement, datasheet in pdf, manual, schematic, equivalent, cross reference.

SAMSUNG Obsolete Part

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