Texas Instruments (NASDAQ: TXN) has introduced the world’s smallest microcontroller unit (MCU), expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. The MSPM0C1104 MCU, housed in a wafer chip-scale package (WCSP), measures only 1.38mm²—about the size of a black pepper grain. This ultra-compact design allows engineers to optimize PCB space for compact applications such as medical wearables and personal electronics without compromising performance.
“PCB space is a valuable and limited resource in ultra-compact systems like earbuds and medical probes,” said Vinay Agarwal, Vice President and General Manager of TI’s MSP Microcontrollers Division. “With the world’s smallest MCU, our MSPM0 MCU portfolio unlocks infinite possibilities, enabling smarter and more connected everyday experiences.”
Texas Instruments’ MSPM0 MCU portfolio consists of over 100 cost-effective MCUs with scalable on-chip analog peripherals and multiple compute options, enhancing the sensing and control capabilities of embedded designs. The MSPM0C1104 MCU was recently showcased at Embedded World in Nuremberg, Germany.
Consumers increasingly demand that everyday electronic devices, such as electric toothbrushes and styluses, become smaller, more affordable, and feature-rich. To innovate in product miniaturization, engineers need highly integrated components that maximize PCB space while adding functionality. Leveraging WCSP packaging technology, the MSPM0C1104 MCU features an optimized function set and cost-efficient design from Texas Instruments. With an 8-ball WCSP measuring just 1.38mm², it is 38% smaller than comparable products.
This MCU includes 16KB of memory, a 12-bit three-channel ADC, and six general-purpose I/O pins. It also supports standard communication interfaces, including UART, SPI, and I2C. By integrating precise high-speed analog components, the MSPM0C1104 enables engineers to maintain embedded system computing performance without increasing PCB size.
The MSPM0C1104 MCU is part of the MSPM0 MCU family, which emphasizes scalability, cost optimization, and ease of use to accelerate time-to-market. Texas Instruments provides pin-to-pin compatible packaging options and a diverse function set, catering to personal electronics, industrial, and automotive applications with varying memory, analog, and processing requirements. Additionally, the portfolio offers multiple compact packaging options to optimize PCB layouts and simplify BOM management. This optimization allows engineers to design products of all sizes while reducing system costs and complexity.
Texas Instruments further supports engineers with a comprehensive ecosystem, including software development kits tailored for all MSPM0 MCUs, rapid prototyping hardware kits, reference designs, and subsystem examples demonstrating common MCU functionalities. With the Zero Code Studio tool, developers can configure, develop, and run MCU applications within minutes without writing any code. This ecosystem enables design expansion and code reuse with minimal hardware or software modifications. Furthermore, Texas Instruments continues investing in internal manufacturing capabilities to support the growing MSPM0 MCU product line, ensuring long-term availability and innovation.
The MSPM0C1104 MCU redefines what’s possible in ultra-compact embedded designs by delivering high performance in an incredibly small 1.38mm² WCSP package. With its efficient integration of memory, high-speed analog components, and standard communication interfaces, this MCU enables engineers to push the boundaries of miniaturization without sacrificing functionality. As part of TI’s scalable and cost-effective MSPM0 MCU portfolio, it provides design flexibility across a wide range of applications, from wearable medical devices to personal electronics. Combined with TI’s robust development ecosystem and commitment to innovation, the MSPM0C1104 empowers engineers to create smarter, more connected, and space-efficient solutions for the future.
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