H5DU2562GTR-E3C HYNIX TSOP66 DDR

HYNIX
  • H5DU2562GTR-E3C

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  • Part Number
  • H5DU2562GTR-E3C
  • Product Categories
  • Memory
  • Package
  • TSOP66
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The H5DU2562GTR-E3C from HYNIX manufacturer is a Memory with DRAM CHIP DDR SDRAM 256M-BIT 16MX16 2.5V 66-PIN TSOP-II. More details for H5DU2562GTR-E3C can be seen below.

Details

The H5DU2562GTR-E3C is a dynamic random-access memory (DRAM) module designed by SK Hynix, a prominent semiconductor company. This memory module boasts several key features and finds use in various applications across different industries.


Feature

High Capacity: The H5DU2562GTR-E3C offers a large memory capacity, making it suitable for applications that require substantial data storage and processing capabilities.

High Speed: It operates at high clock speeds, enabling rapid data transfer and access, which is crucial for memory-intensive tasks and applications.

Low Power Consumption: The module is engineered to consume minimal power, ensuring energy efficiency and improved performance in power-sensitive applications.

Reliable Performance: It delivers reliable and stable performance, contributing to the seamless operation of various computing and data-intensive tasks.

Compatibility: It is compatible with a wide range of computing systems and architectures, making it a versatile choice for different electronic devices and applications.


Application

Computer Systems: The H5DU2562GTR-E3C is commonly utilized in computer systems, servers, and workstations to provide high-capacity and high-speed memory for data-intensive computing tasks.

Graphics Processing: It finds application in graphics cards and GPUs, enhancing the rendering and processing capabilities of graphics-intensive applications such as gaming and multimedia content creation.

Networking Equipment: It is integrated into networking devices and equipment to facilitate high-speed data processing and storage, ensuring efficient and reliable data transmission within networking infrastructures.

Industrial Applications: The module is used in various industrial applications, including automation systems, robotics, and other industrial equipment, where high-performance memory is essential for handling complex data processing tasks.

Telecommunications: It is employed in telecommunications infrastructure and equipment, contributing to the efficient management and processing of data in communication networks and systems.

Categories
DDR
Manufacturer
HYNIX
Veswin Part Number
V1518-H5DU2562GTR-E3C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Condition
New & Original - Factory Package
Stock Status
In-Stock Inventory
Minimum order
1
Estimated Delivery Time
On Apr 25 - Apr 30 (Choose Expedited Shipping)
EDA / CAD Models
H5DU2562GTR-E3C by SnapEDA
Storage Condition
Dry storage cabinet & Humidity protection package
speed
400MHz
product_type
DDR2 SDRAM
product_name
H5DU2562GTR-E3C
package_case
FBGA
organization
256M x 8
operating_voltage
1.8V
operating_temperature
0°C to 95°C
memory_size
2Gb
manufacturer
SK Hynix

HYNIX Inventory

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HYNIX Original Stock

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  • A: We will ship via FedEx or DHL or UPS, Normally will take 4 or 5 days to arrive at your office.
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  • Q: H5DU2562GTR-E3C Warranty?
  • A: We Provide 90 days warranty for our product.
  • Q: H5DU2562GTR-E3C Technical Support?
  • A: Yes, Our product technical engineer will help you with the H5DU2562GTR-E3C pinout information, application notes, replacement, datasheet in pdf, manual, schematic, equivalent, cross reference.

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